| Technical Capability for HDI Board | |||
| Items | 2025 | 2026 R&D | |
| Sample | MP | ||
| Max. Layer Count | 36 | 26 | 42 |
| Stack-Up | 1+N+1 to 9+N+9，Any layer ect. | ||
| Overall Board Thickness (mm) | 0.3-6.5 | 0.35-6.0 | 0.3-8.0 |
| Min. Trace Width/Space | 0.04/0.04mm (1.6/1.6mil) | 0.05/0.05mm (2/2mil) | 0.038/0.038mm (1.5/1.5mil) |
| Min Core Thickness (mm) | 0.04 | 0.05 | 0.04 |
| Min Prepreg Thickness (mm) | 0.035 | 0.04 | 0.03 |
| Min. Via Hole Diameter (Mechanical Drill) | 0.1+/0.076mm | 0.15mm+/-0.076mm | 0.1+/-0.05mm |
| Min. Micro Via Hole Diameter (Laser Drill) | 0.065mm | 0.075mm | 0.05mm |
| Max. Aspect Ratio (Through-hole) | 26:1 | 24:1 | 30:1 |
| Max. Aspect Ratio (Micro via) | 1:1 | 0.8:1 | 1:01 |
| Via Filling Dimple (O/I) (mm) | 0.015/0.010 | 0.015/0.010 | 0.010/0.010 |
| Laser Registration on Target Pad (mm) | 0.035 | 0.05 | 0.03 |
| S/M Registration (mm) | ±0.020 | ±0.025 | ±0.015 |
| Min. BGA (pitch) (mm) | 0.3 | 0.32 | 0.3 |
| Min S/M Opening (mm) | 0.125 | 0.15 | 0.1 |
| Impedance Tolerance (Inner Layer) | +/-8% | +/-10% | +/-7% |
| Surface Finish | ENIG, LF-HASL, OSP, EPIG, ENEPIG, Immersion silver, Immersion Tin, Gold plated, Gold Finger Plating, ENIG+OSP, ENIG+G/F(gold finger), Panel plated gold+G/F,Plated selective gold etc. | ||
| Special Process | Embedded Copper Coin PCB, Heavy Copper, POFV, Hybrid Presssing/Laminating, Depth Control Routing, Depth Control Drilling, Segmented gold finger, back drill, counterbore hole,countersunk hole etc. | ||
