Technical Capability for HDI Board
Items	2025		2026 R&D
	Sample	MP
Max.  Layer Count	36	26	42
Stack-Up	1+N+1 to 9+N+9，Any layer ect.
Overall Board Thickness (mm)	0.3-6.5	0.35-6.0	0.3-8.0
Min. Trace Width/Space	0.04/0.04mm (1.6/1.6mil)	0.05/0.05mm (2/2mil)	0.038/0.038mm (1.5/1.5mil)
Min Core Thickness (mm)	0.04	0.05	0.04
Min Prepreg Thickness (mm)	0.035	0.04	0.03
Min. Via Hole Diameter (Mechanical Drill)	0.1+/0.076mm	0.15mm+/-0.076mm	0.1+/-0.05mm
Min. Micro Via Hole Diameter (Laser Drill)	0.065mm	0.075mm	0.05mm
Max. Aspect Ratio (Through-hole)	26:1	24:1	30:1
Max. Aspect Ratio (Micro via)	1:1	0.8:1	1:01
Via Filling Dimple (O/I) (mm)	0.015/0.010	0.015/0.010	0.010/0.010
Laser Registration on Target Pad (mm)	0.035	0.05	0.03
S/M Registration (mm)	±0.020	±0.025	±0.015
Min. BGA (pitch) (mm)	0.3	0.32	0.3
Min S/M Opening (mm)	0.125	0.15	0.1
Impedance Tolerance (Inner Layer)	+/-8%	+/-10%	+/-7%
Surface Finish	ENIG, LF-HASL, OSP, EPIG, ENEPIG, Immersion silver, Immersion Tin, Gold plated, Gold Finger Plating, ENIG+OSP, ENIG+G/F(gold finger), Panel plated gold+G/F,Plated selective gold etc.
Special Process	Embedded Copper Coin PCB, Heavy Copper, POFV, Hybrid Presssing/Laminating, Depth Control Routing, Depth Control Drilling, Segmented gold finger, back drill, counterbore hole,countersunk hole etc.