| Technical Capability for IMS PCB |
| Items | 2025 | 2026 |
| Sample | MP |
| Max. Layer Count (IMS) | 4 | 2 | 6 |
| IMS laminate Core: | Aluminum/Copper Base Core |
| Max. Board Size for IMS 1L (mm) | 1490 x 580 | 1500 x 650 |
| Max. Board Size for IMS 2L (mm) | 1190* 550 | 1190* 650 |
| Laminate Available: | Bergquist, Shengyi, Ventec, PTTC, CHINSHI, BOYU,GDM etc. |
| Overall Board Thickness (mm) | 0.3-5.0 | 0.4-4.0 | 0.3-6.0 |
| Maxed Cu Thickness | Outer Layer | H OZ-6 OZ | H OZ-10 OZ |
| Min. Trace Width/Space (mm) | Inner Layer | 0.075/0.075 | 0.050/0.050 |
| Outer Layer | 0.075/0.075 | 0.050/0.050 |
| Min. Via Hole Diameter | 0.2 | 0.15 |
| Max. Aspect ratio | 20:1 | 16:1 | 22:1 |
| Min. S/M Registration (mm) | ±0.020 | ±0.030 | ±0.015 |
| Min. S/M Web (mm) | 0.05 | 0.065 | 0.05 |
| Layer to Layer Registration (mm) | ±0.114 | ±0.125 | ±0.100 |
| Min. Back-drilled Stub length (mm) | 0.05-0.20 | 0.05-0.25 | 0.05-0.20 |
| Impedance Tolerance | ±7% | ±8% | ±7% |
| Surface Finish | ENIG, LF-HASL, OSP, EPIG, ENEPIG, Immersion silver, Immersion Tin, Gold plated, Gold Finger Plating, ENIG+OSP, ENIG+G/F(gold finger), Panel plated gold+G/F,Plated selective gold etc. |
| Special Process | Depth Control Routing, Depth Control Drilling, counterbore hole,countersunk hole etc. |
