| Technical Capability for RIGID FLEX PCB |
| Items | 2025 | 2026 R&D |
| Sample | MP |
| Max. Layer Count (Rigid Flex PCB) | 36L | 26L | 40L |
| Max. Layer Count (Flex PCB) | 10L | 1L | 14L |
| Multi-layer FPC (Air Gap) | 2 + (1F+1F+1F+1F+ 1F+1F+1F+1F+1F+1F) +2 | 2 + (1F+1F+1F+1F+1F+1F) + 2 | 2 + (1F+1F+1F+1F+ 1F+1F+1F+1F+1F+1F) +2 |
| Board Thickness | Flexible Min. | 21.5um | 28um | 20.0um |
| RF Max. | 7.0mm | 6.5mm | 7.5mm |
| Max. Board Size | 2~4 Layers | 1100* 500mm |
| ≥6 Layers | 950* 500mm |
| Min. Mechanical Hole Size(mm) | 0.1mm | 0.15mm | 0.1mm |
| Min. Trace Width/Space (mm) | 0.038/0.05um (1.5/2mil) | 0.005/0.05um (2/2mil) | 0.038/0.038um (1.5/1.5mil) |
| PCB Laser Via hole size (CO2) | 76.2um/3mil (dielectric layer < 80um) | 76.2um/3mil (dielectric layer < 80um) | |
| Via Filling Dimple (O/I) (mm) | 0.01 | 0.015 | 0.01 |
| PTH to Inner Pattern (mm) | 0.175 | 0.25 | 0.175 |
| NPTH to Inner Pattern (mm) | 0.125 | 0.175 | 0.125 |
| Inner Copper | 1/3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz |
| Aspect Ratio | 16:1 | 14:1 | 18:1 |
| Depth Keeping Routing (FR) | 75um | 100um | 70um |
| Bonding Gold Finger Pitch Tolerance (pitch≤0.045) (mm) | ±0.025 | ±0.03 | ±0.025 |
| Gold Finger Width (≤0.050) Tolerance (mm) | ±0.015 | ±0.02 | ±0.015 |
| Via to Rigid-Flexible Edge (mm) | Plug Hole | 0.45 | 0.6 | 0.45 |
| Non-plug Hole | 0.4 | 0.5 | 0.4 |
| Transition Zone of Rigid-flexible Joint (mm) | 0.8 | 1.2 | 0.8 |
| Glue Overflow Control at Rigid and Flexible Joint (mm) | 0.25 | 0.3 | 0.25 |
| Material Available | EM827, EM285, EM370D, EM370Z, 370HR, FR408HR, IT158, IT180A, NY2150, VT481, VT901, S1141, S1000-2M, R-F775/R-F777, AP85/AP91/AP92, AS2L, 2FPDR etc. |
