Technical Capability for Rigid FR-4 PCB
Items 2025 2026 R&D
Sample MP
Max. Layer Count (FR-4) 42 36 48
Max. Board Size for 1L (mm) 1490 x 580 1190 x 580 1500 x 650
Max. Board Size for 2L (mm) 1100* 550 750 x 580 1200* 650
Max. Board Size for HLC (high layer count ) (mm) 950* 650 750 x 580 1000* 650
Laminate Available: KB, ITEQ, NANYA, Shengyi, Panasonic, ISOLA, ROGERS, VENTEC, EMC, ARLON etc.
Overall Board Thickness (mm) 0.3-6.5 0.35-6.0 0.3-8.0
Maxed Cu Thickness Inner Layer 1/3 OZ~15 OZ H OZ~12 OZ H OZ~18 OZ
Outer Layer 1/H OZ~20 OZ 1/H OZ~18 OZ 1/3 OZ~22 OZ
Min. Trace Width/Space Inner Layer 0.04/0.04mm (1.6/1.6mil) 0.05/0.05mm (2/2mil) 0.038/0.038mm (1.5/1.5mil)
Outer Layer 0.05/0.05mm (2/2mil) 0.064/0.064 (2.5/2.5mil) 0.04/0.04mm (1.6/1.6mil)
Min. Via Hole Diameter (Mechanical drilling) 0.1+/0.076mm 0.15mm+/-0.076mm 0.1+/-0.05mm
Max. Aspect ratio 26:1 30:1
Min. S/M Registration (mm) ±0.020 ±0.030 ±0.015
Surface Finish ENIG, LF-HASL, OSP, EPIG, ENEPIG, Immersion silver, Immersion Tin, Gold plated, Gold Finger Plating, ENIG+OSP, ENIG+G/F(gold finger), Panel plated gold+G/F, Plated selective gold etc.
Special Process Embedded Copper Coin PCB, Heavy Copper, POFV, Hybrid Presssing/Laminating, Depth Control Routing, Depth Control Drilling, Segmented gold finger, back drill, counterbore hole, countersunk hole etc.