Technical Capability for Rigid FR-4 PCB
Items		2025		2026 R&D
		Sample	MP
Max. Layer Count (FR-4)		42	36	48
Max. Board Size for 1L (mm)		1490 x 580	1190 x 580	1500 x 650
Max. Board Size for 2L (mm)		1100* 550	750 x 580	1200* 650
Max. Board Size for HLC (high layer count ) (mm)		950* 650	750 x 580	1000* 650
Laminate Available:		KB, ITEQ, NANYA, Shengyi, Panasonic, ISOLA, ROGERS, VENTEC, EMC, ARLON etc.
Overall Board Thickness (mm)		0.3-6.5	0.35-6.0	0.3-8.0
Maxed Cu Thickness	Inner Layer	1/3 OZ~15 OZ	H OZ~12 OZ	H OZ~18 OZ
	Outer Layer	1/H OZ~20 OZ	1/H OZ~18 OZ	1/3 OZ~22 OZ
Min. Trace Width/Space	Inner Layer	0.04/0.04mm (1.6/1.6mil)	0.05/0.05mm (2/2mil)	0.038/0.038mm (1.5/1.5mil)
	Outer Layer	0.05/0.05mm (2/2mil)	0.064/0.064 (2.5/2.5mil)	0.04/0.04mm (1.6/1.6mil)
Min. Via Hole Diameter (Mechanical drilling)		0.1+/0.076mm	0.15mm+/-0.076mm	0.1+/-0.05mm
Max. Aspect ratio		26:1		30:1
Min. S/M Registration (mm)		±0.020	±0.030	±0.015
Surface Finish		ENIG, LF-HASL, OSP, EPIG, ENEPIG, Immersion silver, Immersion Tin, Gold plated, Gold Finger Plating, ENIG+OSP, ENIG+G/F(gold finger), Panel plated gold+G/F, Plated selective gold etc.
Special Process		Embedded Copper Coin PCB, Heavy Copper, POFV, Hybrid Presssing/Laminating, Depth Control Routing, Depth Control Drilling, Segmented gold finger, back drill, counterbore hole, countersunk hole etc.