Product Information
Among all metal core PCBs, Aluminum PCB is the most common type. The base material consists of aluminum core and standard FR4 material. It features a thermal clad layer that dissipates heat in a highly efficient manner while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCB is regarded as the solution to high power and tight tolerance applications.
Advantages of Aluminum PCB：
- Environmentally friendl Aluminum is non-toxic and recyclable.
- Heat dissipation. Aluminum can transfer heat away from vital components, thus minimizing the harmful effect it could have on the circuit board.
- Higher durability: Aluminum provides strength and durability to a product, and it can reduce accidental breakage during manufacturing, handling, and everyday use.
- Lightweight: Aluminum is a lightweight metal.
Related performance characteristics of Aluminum PCB
(1) Heat dissipation: Because the aluminum substrate is an alloy aluminum copper-clad pcb board, the heat conduction of aluminum metal is very fast. Ordinary printed board substrates such as FR4 and CEM3 are poor conductors of heat, and the interlayer insulation prevents heat from being dissipated. The heat dissipation advantages of aluminum substrates can directly reduce the operating temperature of electronic products, improve product power density and reliability, and effectively extend the service life of electronic products.
(2) Dimensional stability: Aluminum-based printed boards are obviously much more stable in size than printed boards made of insulating materials. Aluminum-based printed boards and aluminum sandwich panels are heated from 30°C to 140~150°C, and the dimensional change is 2.5~3.0%.
(3) Thermal expansion: thermal expansion and contraction are the common nature of substances, and the thermal expansion coefficients of different substances are different. The aluminum-based printed board can effectively solve the problem of heat dissipation, thereby alleviating the problem of thermal expansion and cold contraction of different components on the printed board, and improving the durability and reliability of the whole machine and electronic equipment. Especially to solve the problem of thermal expansion and contraction of SMT (Surface Mount Technology).
⑷Other reasons: Aluminum-based printed boards have shielding effect; replace brittle ceramic substrates; use surface mount technology with confidence; reduce the real effective area of printed boards; replace components such as radiators, and improve product heat resistance and physical properties ; Reduce production costs and labor.
- Application of Aluminum PCB
1、Excellent mechanical processing performance, replacing fragile ceramic circuit boards.
2、The use of aluminum substrates can reduce the installation of radiators, reduce product volume, save hardware and reduce assembly costs.
The many characteristics of the aluminum substrate make it widely used in the electronic field, such as power hybrid IC (HIC tuning; power amplifier audio equipment; switching regulator power supply equipment; high-frequency sending circuit communication electronic equipment; motor driver automation equipment; automotive power control Devices, solid state relay power modules; and single-sided LED aluminum substrates are widely used in indoor and outdoor LED energy-saving lighting electronic products due to their simple processing, low production cost, and good heat dissipation.
Why Choose HSX
HSX Circuit, a manufacturer of single-sided and double-sided aluminum substrates, is positioned in the professional manufacturing of high-performance and high-thermal conductivity LED aluminum substrates, copper substrates (thermoelectric separation), copper-aluminum composite panels and other metal panels. The company has a full set of automatic production equipment and precision testing equipment that are professionally used in the production of metal plates (aluminum substrates, copper substrates), and has been focusing on the development and manufacture of metal aluminum substrates for 10 years.
Leading process capability to meet Aluminum PCB manufacturing needs
- Minimum pitch 0.10mm
Minimum aperture 0.15mm
Hole wall copper thickness >0.025mm
Metallized aperture tolerance ±0.05mm
Non-metallized aperture tolerance e ±0.05mm
Hole position tolerance ±0.076mm
Dimension tolerance ±0.1mm
Slotted 30°/45°/60°
Minimum BGA pad 14mil
PCB AC impedance control ≤50Ω ±5Ω
>50Ω ±10%
Matters needing attention in the production of aluminum substrates
1.Due to the high cost of aluminum-based materials, special attention should be paid to the standardization of operations during the production process to prevent scrapping due to irregular operations.
2.Operators in each process must handle it with care to avoid scratches on the board surface and aluminum base surface.
3.Operators in each process should try to avoid touching the effective area of the aluminum substrate with their hands. When holding the board during tin spraying and subsequent processes, they are only allowed to hold the edge of the board, and it is strictly forbidden to directly touch the inside of the board with fingers.
4.The aluminum substrate is a special board, and its production should be highly valued by all districts and processes. The section chief and foreman will personally check the quality to ensure the smooth production of the board in each process.
PCB acceptance criteria
- IPC-A-600G standard (PCB conformity standard);
- GJB326A-96(military standard);
- IPC-6018A (high frequency board acceptance standards)
- Implementation of quality PDCA cycle process, continuous improvement of product performance imported from the United States Diane ion chromatography tester (DIONEXICS-900) and temperature cycle inspection equipment to ensure high reliability and stability of the product.
Why Choose HSX
Top high-frequency material resources, so that your products win at the root
The factory always has imported and domestic plates with dielectric constants ranging from 2.2 to 10.6
- High frequency materials: Rogers/Rogers, taconic/taikangli, Arlon, Isola, F4BM/Wangling, PTFE/Teflon, TP-2, etc., with dielectric constants ranging from 2.2 to 10.6.
- Rogers series: Rogers RO4350B, RO4003C, RT5880, RT5870, ro3003, ro3010, RO4730, RT6006, RT6010, etc.
Leading process capability to meet high frequency PCB manufacturing needs
- Max. thickness to diameter ratio 10:1 Max. copper thickness 6OZ Max. working board size 2000x610mm
- The thinnest 4-layer board 0.33mm The smallest hole 0.10mm
- Minimum line width/line spacing 3mil/3mil
- Proven hybrid technology: ROGERS/Rogers+FR4,FR4+PTFE,FR4+408HR,ceramic+FR4 etc.
Experienced
PCB high-frequency board samples + small and medium batch, more than ten years of experience, skilled in PCB high-frequency board expertise
Products are: FR4 glass fiber board double-sided multilayer circuit board / high frequency board / high frequency circuit board / high frequency mixed laminate / mixed media laminate / F4B high frequency board / microwave RF board / high frequency microwave board, etc., the power splitter, coupler, combiner, power amplifier, dry amplifier, base station, RF antenna, 4G antenna used in the high frequency circuit board has professional production experience
PCB acceptance criteria
- IPC-A-600G standard (PCB conformity standard);
- GJB326A-96(military standard);
- IPC-6018A (high frequency board acceptance standards)
- Implementation of quality PDCA cycle process, continuous improvement of product performance imported from the United States Diane ion chromatography tester (DIONEXICS-900) and temperature cycle inspection equipment to ensure high reliability and stability of the product.
